#9 - Inductors on Silicon, Skills for Fabs, Cameras, TPMS, and more!
Welcome to show #9 of News Bytes, Elektor's news show looking at what's happening in the electronics and semiconductor industry.
This episode is sponsored by DownStream. DownStream Technologies’ software helps engineering organizations optimize and automate the PCB Release Process. DownStream’s tools redefine how engineers and PCB designers post-process PCB designs to create and distribute all the deliverables required for a complete PCB assembly release package. Their flagship product - CAM350® - provides verification and optimization before designs are transferred to the fabricator to ensure the successful manufacture of bare PCB boards. Also available is BluePrint-PCB®, which uses its CAD database to quickly produce comprehensive documentation to drive PCB fabrication, assembly, and inspection processes.
More information about DownStream can be found at https://downstreamtech.com
In this episode, Stuart Cording, The Electronics Reporter, looks at:
[00:00] Intro to the show!
[00:46] Silanna Semiconductor has launched a new evaluation board featuring their SZPL 3002A DC-DC converter IC. This intelligent buck converter supports the development of 65-watt multi-port USB-PD and QC fast chargers with its two type C and one type A USB ports. https://powerdensity.com/wp-content/uploads/2023/09/11519-SZPL3002AA-EVB03-User-Guide.pdf
[02:08] Intel is tackling a shortage of technicians for semiconductor fabs with a new community college course in Ohio. The course includes an introduction to manufacturing, semiconductor technology, and vacuum systems. https://www.intel.com/content/www/us/en/newsroom/opinion/intel-addresses-semiconductor-workforce-shortage.html
[03:17] Rohm launches a new, tiny proximity sensor that measures just one by two millimeters. The RPR-0720 is perfect for applications that monitor attachment and detachment, such as charging cases for Bluetooth earbuds. https://www.rohm.com/products/optical-sensors/reflective-type-photosensors/rpr-0720-product
[05:21] Nuvoton’s latest series of MCUs target high-efficiency motor control in consumer and industrial applications. The new KM1M4BF uses an Arm Cortex-M4F core operating at up to 120 megahertz and features up to 256 kilobytes of flash and 16 of SRAM. https://www.nuvoton.com/products/microcontrollers/arm-cortex-m4-mcus/km1m4bf-series/?tab=1
[06:35] Onsemi's Hyperlux image sensors, offering a dynamic range of 150 db, can distinguish between a yellow and red stoplight at distance, even when facing a setting sun, a situation where human eyes would likely be blinded. They are now supported with drivers on Nvidia’s DRIVE platform, ensuring this powerful technology combination is easily integrated into this open, scalable AI system. https://www.onsemi.com/solutions/technology/hyperlux
[07:41] Sweden-based IAR, a leader in embedded development software and services, is helping their developers with a collaboration with Edge Impulse, one of the best-known names in embedded AI. https://www.iar.com/news/press-releases/2023/iar-and-edge-impulse-to-provide-iar-customers-worldwide-with-integrated-ai-and-ml-capabilities/
[08:42] Bel Fuse's latest 4 kilowatt liquid-cooled DC-DC converter targets both hybrid and fully electric vehicles. Compared to the previous generation, it supports a wider 450 to 900 volt input range and weighs only 4.5 kilograms. https://www.belfuse.com/product-detail/power-solutions-custom-value-added-solutions-emobility-700dng40-24-down-converter
[09:48] Seco has announced a scalable HMI family of modular displays for applications such as industrial processing equipment, EV charging stations, and digital signage. The new platform builds upon Seco’s existing ARM and x86 technologies with sizes of seven, ten, and fifteen inches. https://edge.seco.com/usa/modular-vision-7-mx93.html
[10:50] X-FAB, an analog and mixed-signal silicon foundry, has announced its new integrated passive device, or XIPD, fabrication capabilities. This allows customers to integrate inductors, capacitors, and resistors onto their designs. https://www.xfab.com/technology/rf#c32260
[12:06] Infineon's XENSIV SP49 integrates a MEMS sensor alongside an ASIC to support TPMS capabilities, including on-tire auto-position sensing, tire inflation assistance, tire blowout detection, and load detection. https://www.infineon.com/cms/en/about-infineon/press/market-news/2023/INFATV202309-149.html
Please like, subscribe, and share if you've enjoyed this show. And if you have some industry news to share, get in touch with Stuart Cording on LinkedIn (https://www.linkedin.com/in/stuart-cording/).
This episode is sponsored by DownStream. DownStream Technologies’ software helps engineering organizations optimize and automate the PCB Release Process. DownStream’s tools redefine how engineers and PCB designers post-process PCB designs to create and distribute all the deliverables required for a complete PCB assembly release package. Their flagship product - CAM350® - provides verification and optimization before designs are transferred to the fabricator to ensure the successful manufacture of bare PCB boards. Also available is BluePrint-PCB®, which uses its CAD database to quickly produce comprehensive documentation to drive PCB fabrication, assembly, and inspection processes.
More information about DownStream can be found at https://downstreamtech.com
In this episode, Stuart Cording, The Electronics Reporter, looks at:
[00:00] Intro to the show!
[00:46] Silanna Semiconductor has launched a new evaluation board featuring their SZPL 3002A DC-DC converter IC. This intelligent buck converter supports the development of 65-watt multi-port USB-PD and QC fast chargers with its two type C and one type A USB ports. https://powerdensity.com/wp-content/uploads/2023/09/11519-SZPL3002AA-EVB03-User-Guide.pdf
[02:08] Intel is tackling a shortage of technicians for semiconductor fabs with a new community college course in Ohio. The course includes an introduction to manufacturing, semiconductor technology, and vacuum systems. https://www.intel.com/content/www/us/en/newsroom/opinion/intel-addresses-semiconductor-workforce-shortage.html
[03:17] Rohm launches a new, tiny proximity sensor that measures just one by two millimeters. The RPR-0720 is perfect for applications that monitor attachment and detachment, such as charging cases for Bluetooth earbuds. https://www.rohm.com/products/optical-sensors/reflective-type-photosensors/rpr-0720-product
[05:21] Nuvoton’s latest series of MCUs target high-efficiency motor control in consumer and industrial applications. The new KM1M4BF uses an Arm Cortex-M4F core operating at up to 120 megahertz and features up to 256 kilobytes of flash and 16 of SRAM. https://www.nuvoton.com/products/microcontrollers/arm-cortex-m4-mcus/km1m4bf-series/?tab=1
[06:35] Onsemi's Hyperlux image sensors, offering a dynamic range of 150 db, can distinguish between a yellow and red stoplight at distance, even when facing a setting sun, a situation where human eyes would likely be blinded. They are now supported with drivers on Nvidia’s DRIVE platform, ensuring this powerful technology combination is easily integrated into this open, scalable AI system. https://www.onsemi.com/solutions/technology/hyperlux
[07:41] Sweden-based IAR, a leader in embedded development software and services, is helping their developers with a collaboration with Edge Impulse, one of the best-known names in embedded AI. https://www.iar.com/news/press-releases/2023/iar-and-edge-impulse-to-provide-iar-customers-worldwide-with-integrated-ai-and-ml-capabilities/
[08:42] Bel Fuse's latest 4 kilowatt liquid-cooled DC-DC converter targets both hybrid and fully electric vehicles. Compared to the previous generation, it supports a wider 450 to 900 volt input range and weighs only 4.5 kilograms. https://www.belfuse.com/product-detail/power-solutions-custom-value-added-solutions-emobility-700dng40-24-down-converter
[09:48] Seco has announced a scalable HMI family of modular displays for applications such as industrial processing equipment, EV charging stations, and digital signage. The new platform builds upon Seco’s existing ARM and x86 technologies with sizes of seven, ten, and fifteen inches. https://edge.seco.com/usa/modular-vision-7-mx93.html
[10:50] X-FAB, an analog and mixed-signal silicon foundry, has announced its new integrated passive device, or XIPD, fabrication capabilities. This allows customers to integrate inductors, capacitors, and resistors onto their designs. https://www.xfab.com/technology/rf#c32260
[12:06] Infineon's XENSIV SP49 integrates a MEMS sensor alongside an ASIC to support TPMS capabilities, including on-tire auto-position sensing, tire inflation assistance, tire blowout detection, and load detection. https://www.infineon.com/cms/en/about-infineon/press/market-news/2023/INFATV202309-149.html
Please like, subscribe, and share if you've enjoyed this show. And if you have some industry news to share, get in touch with Stuart Cording on LinkedIn (https://www.linkedin.com/in/stuart-cording/).